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  Datasheet File OCR Text:
 SMD Type
HEXFET Power MOSFET KRFR9310
Transistors IC
TO-252
+0.15 1.50-0.15
+0.15 6.50-0.15 +0.2 5.30-0.2 +0.1 2.30-0.1 +0.8 0.50-0.7
Unit: mm
Features
Surface Mount
+0.2 9.70-0.2
Fast Switching P-Channel Avanced Process Technology Fully Avalanche Rated
+0.1 0.80-0.1
+0.15 0.50-0.15
0.127 max
+0.28 1.50-0.1
+0.25 2.65-0.1
+0.15 5.55-0.15
2.3
+0.15 4.60-0.15
+0.1 0.60-0.1
1. Gate 2. Drain 3. Source
Absolute Maximum Ratings Ta = 25
Parameter Continuous Drain Current, VGS @ -10V,Tc = 25 Continuous Drain Current, VGS @ -10V,Tc = 100 Pulsed Drain Current*1 Power Dissipation Tc = 25 Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy*3 Avalanche Current *1 Repetitive Avalanche Energy *1 Peak Diode Recovery dv/dt *2 Operating Junction and Storage Temperature Range Junction-to-Case Junction-to-Ambient Junction-to-Ambient VGS EAS IAR EAR dv/dt TJ,TSTG R R R
JC JA JA
Symbol ID ID IDM PD
Rating -1.8 -1.1 -7.2 50 0.4 20 92 -1.8 5 -24 -55 to + 150 2.5 50 110
Unit
A
W W/ V mJ A mJ V/ns
/W /W /W
*1 Repetitive rating; pulse width limited by max. junction temperature. *2 ISD -1.1A, di/dt 450A/ s, VDD V(BR)DSS,TJ 150
*3 Starting TJ = 25 , L = 57 mH,RG = 25 , IAS = -1.8A.
3.80
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1
SMD Type
KRFR9310
Electrical Characteristics Ta = 25
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Qg Qgs Qgd td(on) tr td(off) tf LD Symbol V(BR)DSS
V(BR)DSS/
Transistors IC
Testconditons VGS = 0V, ID =- 250 A TJ ID = -1mA,Reference to 25 VGS = -10V, ID = -1.1A*1 VDS = VGS, ID = -250 A VDS = -50V, ID = -1.1A*1 VDS = -400V, VGS = 0V VDS = -320V, VGS = 0V, TJ = 125
Min -400
Typ
Max
Unit V
-0.41 7.0 -2.0 0.91 -100 -500 -100 100 13 3.2 5.0 11 10 25 24 4.5 -4.0
V/
RDS(on) VGS(th) gfs IDSS
V S A
IGSS
VGS = 20V VGS = -20V ID = -1.1A VDS = -320V VGS = -10V,*1 VDD = -200V ID = -1.1A RG =21 RD =180 *1
nA
nC
ns
nH
Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time *1 Pulse width 300 s; duty cycle 2%. Body Diode)
LS Ciss Coss Crss IS ISM VSD trr Qrr ton TJ = 25 , IS = -1.1A, VGS = 0V*1 TJ = 25 , IF = -1.1A di/dt = 100A/ s*1 VGS = 0V VDS = -25V f = 1.0MHz
7.5 270 50 8.0 -1.8
nH
pF
A Body Diode) *2 -7.2 -4.0 170 640 260 960 V ns C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
*2 Repetitive rating; pulse width limited bymax
2
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